Here is the abstract you requested from the IMAPS_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|The electrical and mechanical performance of Quilt Packaging based on solder paste|
|Keywords: Quilt Packaging, pull test, thermal cycling|
|Quilt Packaging (QP), a novel interlocking edge chip-to-chip interconnection, invented at the University of Notre Dame, will be discussed. The fabrication process for QP is relatively simple, and the basic idea of Quilt Packaging is to use MEMS-inspired fabrication techniques to form contacts along the vertical edge of the integrated circuit die. The electrical and mechanical performance of QP based on solder paste will be mainly discussed in this paper. Due to the short path of interconnection, the self inductance of QP can be smaller than0.01nH, and the mutual inductance can be smaller than 0.001nH, based on COMSOL simulations. Microwave performance based on coplanar waveguides is simulated and measured. The de-embedded return loss is better than -13 dB up to 11 GHz frequency, and the de-embedded insertion loss is better than -0.8 dB. Finally, the mechanical reliability of QP based on solder paste will be discussed, including novel pull tests specially designed for QP, and thermal cycling. From the experiments, the pull force that causes a full set of edge interconnections to fail is greater than 1 lb-force.|
University of Notre Dame
Notre Dame, IN