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Characterization of Interconnects and RF Components on Glass Interposers
Keywords: Glass Interposer, Interconnects, RF Components
Within the last decade, glass substrates have received significant attention, because of their myriad of advantages over silicon and organic substrates. Consequently, much research effort from academia and industry is currently being invested to develop glass interposers. So far, this effort has concentrated on developing methods for fabricating cylindrical vertical interconnects in glass interposers, i.e., Though Glass Vias (TGVs). However, to fully evaluate the potential of glass as interposer material for microelectronic systems with computing and communication functions, an extensive characterization of interconnects and RF components on these substrates must be carried out. In this contribution, we go beyond state-of-the-art research and present the fabrication and in-depth characterization of planar interconnects (i.e., transmission lines), TGVs and antennas integrated on glass interposers. For this characterization, a combination of analytical, numerical and measurement techniques is used. Prior to the characterization, experimentally extracted loss tangents and relative dielectric constants of different glass substrates are presented.
Dr. Ivan Ndip, Senior Research Engineer & Group Manager
Fraunhofer IZM
Berlin, Berlin
Germany


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