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Advanced Manufacturing Methods for Brazing High-Reliability Electronic Packages
Keywords: brazing, thermal management, high-reliability
Brazing is a critical process for producing reliable adhesion between package metallization and metal components such as heat sinks, seal rings, and connectors. Package performance for signal integrity, mechanical reliability, and thermal management not only relies on improved materials but also on manufacturing methods designed to leverage those improvements. High-reliability packaging for applications in medical, harsh environment, or aerospace requires a thorough understanding of which fabrication processes to select, as well as fixturing and material preparation to meet increasing demands for low electrical losses at higher frequencies and higher thermal conductivity for high-power GaN and SiC devices. In the present work, utilization of manufacturing design tools and methods for optimal brazing will be discussed.
Iris Labadie, Market Development Specialist
Kyocera America, Inc.
San Diego, CA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic