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Thinner and Miniaturization Embedded Device Package, MCeP, for PoP and Module Application
Keywords: Embedded, Package, Module
Along with miniaturization and high functionality of electronics, many embedded device substrates and packages have been developed by various companies. We have been also developing embedded device package named MCeP, Molded Core embedded Package. This package consists of base substrate, upper substrate and molding resin. These substrates material is conventional organic base. Bare IC devices without re-routing are mounted on inner surface of base substrate. Upper substrate and base substrate are connected electrically by copper core solder balls. The space between upper and base substrate is encapsulated by molding resin. MCeP is possible to be adopted for bottom package alternative of PoP. For thinner PoP application less than 1.0mm height, thinner MCeP less than 300um has been investigated. Base substrate has 3 conductive layers and thickness is 130um. Upper substrate has 2 conductive layers and thickness is 95um. Embedded layer thickness is 55um. For conventional MCeP, IC device is mounted by flip chip bonding using Au bump and tin-silver solder. The space between IC device and base substrate is encapsulated by under-filling resin. It is necessary to keep under-filling resin flow area around IC device. Because of this resin flow area, package size should be enlarged. To miniaturize package size, solder bumped IC device and encapsulate by molding resin instead of under-filling resin were used, then resin flow area was eliminated. It achieved miniaturization MCeP. MCeP is embedded not only IC device, but also passive components device, like chip capacitor and chip resister. From these characteristics, MCeP is possible to use bottom package alternative for PoP and module application with IC device and passive components embedded.
Kouichi Tanaka , Process Engineer
Shinko Electric Industries Co., LTD.
Nagano-shi, Nagano
Japan


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