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Temporary Bonding/Debonding - New development overview
Keywords: Temporary Bonding, Debonding, 2.5D/3D
In recent years there have many different new materials/process options for temporary bonding and debonding have been developed and presented mostly by equipment and material suppliers. The technology is still immature. They are still being evaluated and at best they are in prototype stage. As a result, the cost is still perceived to be high, there are no reliability data available and many new users in the market are confused. I will present an independent assessment, description, pros and cons and status of different materials and processes for temporary bonding and debonding. I will also present the equipment and infrastructure partnerships involved with these materials/processes.
Rajen Chanchani,
Albuquerque, NM

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic