Here is the abstract you requested from the IMAPS_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Radiation Mechanisms and Electromagnetic Interference in Ceramic Electronic Packages|
|Keywords: package, EMI, ceramic|
|A full-wave electromagnetic analysis for characterizing typical electromagnetic shielding practices in ceramic electronic packages is presented. Typically in printed circuit board emissions, the power plane emissions, and exposed surface nets are considered, however, the signal interconnect from the PCB to an electronic package can also be a significant source of radiation and hence an electromagnetic interference (EMI) issue. In this paper we describe electromagnetic radiation mechanisms resulting from high-frequency and high-speed applications in ceramic multilayer electronic packages and review typical practices of implementing via fences to mitigate and reduce the EMI risk within a package substrate and when the package is part of a package/board configuration.|
|Jerry Aguirre, Technical Staff Member
Kyocera America Inc
San Diego, Ca