Here is the abstract you requested from the IMAPS_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Advanced 3D Glass Microfabrication for IC Packaging Applications|
|Keywords: Glass, Interposer, TGV|
|Interposer technologies are gathering more importance in IC packaging as the industry continues miniaturization trends in microfabrication nodes and IC packaging to meet design and utility needs in consumer electronics. Furthermore, IC packaging is widely seen as a method to prolong Moore’s law. Historically, silicon has been the material of interest for interposer materials given its prevalence in IC production, but it presents many technical and costs hurdles. In contrast, glass interposer technology presents a low cost alternative, yet attempts at producing advanced through glass vias (TGVs) arrays using traditional methods, such as laser ablation, have inherent process flaws, such as reduced interposer mechanical strength. In this talk, we will present on our latest efforts in glass interposers microfabrication using our proprietary APEX™ Glass ceramic, a photo-sensitive material used to create high density arrays of TGVs using three simple processing steps: exposure, baking, and etching. To date, we have been successful in producing large arrays of 10 micron diameter TGVs, with 20 micron center-to-center pitch, in 100 micron thick APEX™ Glass ceramic. In this talk we will present (1) on our continued efforts on producing large array high aspect ratio TGVs in ultra thin (250-75 micron) APEX™ Glass ceramic wafers, (2) advanced applications of photo-sensitive glass processing, and (3) economic models of APEX™ Glass processing versus silicon processing for interposer applications.|
|Jeb H Flemming, Chief Engineering Officer
3D Glass Solutions