Here is the abstract you requested from the IMAPS_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Embedded Substrates Bursting into the Market|
|Keywords: embedded substrates, thin, prepreg|
|Embedded die and passives in organic substrates have long been touted as the next step in miniaturization of package technology. Conceptually, the advantages are obvious but still today, they have made limited inroads into the market. It appears that every substrate manufacturer as well as research laboratory has devised their own technical solution for embedding and herein lies part of the problem – lack of standardization. This is particularly important in the times of mobile technologies where the volume is in the tens to hundreds of million units per year. Multiple sources are a must in today’s market. But there are many other supply chain issues ranging from commercial design software to substrate test as well as die handling experience by the substrate manufacturer to name a few. Here, a short overview of some of available embedded substrate options will be presented, followed by a prepreg based manufacturing approach. That manufacturing concept evolved from a new single sided substrate to coreless substrates and finally to embedded substrates. The process flow will be described briefly including reliability data. Products in characterization and qualification ranging from two layer power applications to more complex packages will be described. Finally the new manufacturing concept will be introduced.|
|Bernd K Appelt, Director Business Development