Abstract Preview

Here is the abstract you requested from the IMAPS_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Moisture (and other contaminant) control for electronics packaging
Keywords: Moisture control, Contaminant Control, Active Packaging
Extending the life and reliability of electronic devices and assemblies is a function of controlling the environment around the electronics to prevent corrosion, degradation, or contamination of the components. Some corrosive elements are naturally occurring such as moisture or oxygen; most contaminants are introduced in the manufacturing process or in operation, such as chlorides or oils. Environmental control consists of: 1. removing undesirable materials introduced or present during manufacture/packaging, 2. minimizing ingress through proper packaging/enclosure material selection, and 3. adsorption of undesirable materials that actually permeate the barrier material(s) through proper selection of adsorbents. This presentation will cover the basic concepts of environmental control which is also known as active packaging and cover a range of actual applications for illustration. It will also include a case study for a high volume electronics application.
Samuel Incorvia, Senior Product Leader for Electronics
Multisorb Technologies
Buffalo, NY

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic