Here is the abstract you requested from the IMAPS_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Parylene as thin flexible 3-D packaging enabler for biomedical implants|
|Keywords: biomedical implants, parylene interposer, flexible electronics|
|In this presentation, the novel use of Parylene in biomedical implants packaging is described. Parylene is a unique polymer material grown by room-temperature chemical vapor deposition (CVD). Parylene serves as an excellent packaging material for biomedical implants owing to its biocompatibility, flexibility, near-hermeticity, and high-density integration capability in a small form factor. Here, we propose a novel all-Parylene packaging approach to develop implantable and clinically usable miniature devices where Parylene is used as a substrate, an isolation layer, a structural layer, a capacitor insulator, and a sealing layer. The proposed Parylene package is fully integrated with system components including embedded passive devices (EPDs), transmission lines, application-specific integrated circuits (ASICs), microelectromechanical systems (MEMS), and their interconnects. The packaging concept, the fabrication and assembly, the components, and the applications are described in depth. Embedded metal-insulator-metal (MIM) capacitors are implemented on a Parylene substrate using multilayer thin-film technology and their DC and RF characterization are investigated. A wide-range capacitance spanning 1 to 450 pF are achieved with a maximum capacitance density of 450 pF/mm2. In addition, a 3-D trench capacitors technology is developed on a Parylene substrate which further multiplies the capacitance density. These embedded capacitors are utilized to power the circuits on the Parylene package wirelessly, which suggests the wireless communication capability of the implant package with external electronics. Finally, the initial prototype packages are introduced with biomedical application demonstrations. Clinical in-vivo test results are discussed. The authors believe the all-Parylene 3-D packaging technology demonstrated here suggests a general packaging model for implantable medical devices.|
|Jimin Maeng, Graduate Student
West Lafayette, IN