Here is the abstract you requested from the IMAPS_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Pushing the 3rd Dimension – Floppy Wafers, Die and Packages? Stress Induced Chip Package Interactions on Thin Mobile Devices|
|Keywords: Thin die package, Mechanical Stress, Chip Package Interaction|
|Ever thinner form factors for smart phones, tablets and other mobile devices is driving an aggressive scaling of the semiconductor devices/packages that enable them. A survey of the challenges of this trend points to mechanical stress as the major challenge apart from handling damage. Stress driven Chip Package Interactions impact the manufacturing flow, performance and the reliability of the finished product. We examine a number of the factors and risks driven by mechanical stress and discuss some ideas on how to manage and monitor these issues.|
San Diego, CA