Micross

Abstract Preview

Here is the abstract you requested from the IMAPS_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Thin PoP : Warpage control for Thinner PoP package in mobile applications
Keywords: Package on package, 3D package, Warpage reduction
In order to significantly improve warpage of a PoP bottom package, Shinko developed an enhanced PoP structure. The inclusion of a support material attached to the backside of the flip chip die and over molded resin is the structure’s key attribute. By adjusting the balance of each material (mold resin, substrate, and support material thicknesses), we can better control warpage at both room temperature and reflow temperature. This enhanced thin PoP structure can be easily incorporated into a standard assembly process with existing equipment sets. This paper describes simulation results, along with measured warpage characteristics of the new package.
Yuka Tamadate, Manager
Shinko Electric Industries Co.,LTD.
Myoko-shi, Niigata
Japan


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems