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The Distribution and Transport of Alpha Emitting Isotopes in Tin Electronic Materials
Keywords: Pb free, Low Alpha, microsegregation
The presence of alpha emitters in packaging materials pose an increased risk to device reliability as device size decreases and flip chip and 3-D packaging technology becomes more widespread. Particularly troubling is the observation that alpha emission increases over time in some reported instances. Several experiments were conducted to examine alpha flux behavior in tin materials and determine the cause for the temporal alpha emissivity increase. The experiments determined the distribution of the alpha emitters within the material volume, and a mechanism based on microsegregation is presented to explain the non uniform distribution.
Brett M. Clark, Laboratory Supervisor
Honeywell International
Spokane Valley, WA

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