Here is the abstract you requested from the IMAPS_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Scallop Free Si Etching and Low Cost Integration Technologies for 2.5D Si Interposer.|
|Keywords: 2.5D, Low cost, Si DRIE|
|This is particularly new etching method challenging for TSV devices. The etch system is new NLD plasma etcher that is a kind of high electron density ICP. In this paper, study on non Bosch Si etch method to get a smooth sidewalls with no scalloping and a good control of the etched profile using NLD plasma, and trying high selectivity to photo-resist mask for TSV etching in NLD plasma to provide the lowest cost processes.|
|Yasuhiro Morikawa, TSV Project Manager