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Scallop Free Si Etching and Low Cost Integration Technologies for 2.5D Si Interposer.
Keywords: 2.5D, Low cost, Si DRIE
This is particularly new etching method challenging for TSV devices. The etch system is new NLD plasma etcher that is a kind of high electron density ICP. In this paper, study on non Bosch Si etch method to get a smooth sidewalls with no scalloping and a good control of the etched profile using NLD plasma, and trying high selectivity to photo-resist mask for TSV etching in NLD plasma to provide the lowest cost processes.
Yasuhiro Morikawa, TSV Project Manager
ULVAC, Inc.
Susono, Shizuoka
Japan


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