Here is the abstract you requested from the IMAPS_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Solder Joint Ductility|
|Keywords: ductility, solder, mechanical testing|
|Solder joint arrays were tested under tensile loading to determine the stain-to-failure (ductility) under a wide range of conditions. Joints per array 25 to 3840 Joint Pitch (mm) 0.180 to 0.500 Joint Height (mm) 0.061 to 0.220 Pad Diameter (mm) 0.090 to 0.290 Joint Alloy 63Sn37Pb 63Sn37Pb + 95Pb5Sn 95Pb5Sn Sn4.0Ag0.5Cu Sn3.5Ag Sn3.0Ag0.5Cu Sn2.3Ag Sn1.2Ag Sn1.2Ag0.5Cu0.05Ni Sn0.7Cu Pad Metallization (Top pad -- Bottom Pad) NiVCu -- NiVCu Ni -- Cu Ni -- NiAu Post Reflow Aging 24hrs @ 125C Test Temperature -55C to 125C The trends in ductility with alloy, joint size, pad metallization, and test conditions are quantified and discussed. Guidelines for allowable solder joint strain during assembly processes are derived from the ductility data.|
|Robert Darveaux, CVP