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Going Thin – Potential Challenges Faced By The Industry
Keywords: PoP, Warpage Control, Z-height
With the advent of smartphones and tablets, the mobile space is experiencing an exponential growth, mostly driven by consumer demands for faster and thinner mobile devices. As the trend for mobile devices continues towards thinner form factor, the industry is facing challenges in PoPt warpage control, package height reduction, substrate technology and wafer thinning. At Micron Technology, we have been focused extensively on charting out a Z-height and memory density roadmap that meets the market demands. Traditionally, reduction in PoPt package Z-height was limited largely by wafer thinning and stacking process. More recently however, we are finding that for various package configurations, warpage control seems to be the limiter. Our studies show that PoPt warpage control is a critical parameter, which might dictate the direction of the roadmap. This presentation outlines the challenges, and development projects carried out to address them, including appropriate selection of materials/substrates and die stack configuration. This presentation also outlines the potential roadblocks that the industry may face as it gears towards meeting market demands in the coming years.
Sachin Deo, Package Development Engineer
Micron Technology
Boise, ID

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