Here is the abstract you requested from the nano_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Technology and Market Drivers for 3D ICs|
|Keywords: 3D IC, TSVs, wafer stacking|
|This paper will look at the emerging 3D IC microelectronics technologies and at the market forces and technology developments that are driving it now and where it will go in the future. The key market forces will be identified and the presentation will cover the reasons for these markets to turn to 3D ICs as the future solutions to their system needs. The key technologies driving 3D ICs will be detailed.|
|Dr Charles Woychik, Dir Marketing and Technology Analysis
San Jose, CA