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Technology and Market Drivers for 3D ICs
Keywords: 3D IC, TSVs, wafer stacking
This paper will look at the emerging 3D IC microelectronics technologies and at the market forces and technology developments that are driving it now and where it will go in the future. The key market forces will be identified and the presentation will cover the reasons for these markets to turn to 3D ICs as the future solutions to their system needs. The key technologies driving 3D ICs will be detailed.
Dr Charles Woychik, Dir Marketing and Technology Analysis
San Jose, CA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic