Here is the abstract you requested from the nano_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Why Wedge Bond- Nano Devices and Materials?|
|Keywords: interconnect, packaging, wire bonding|
|Wire bonding is a welding process, and ultrasonic welding is accomplished by deforming the wire and the substrate together, forming them into an alloy of the two constituents. Welded interconnects are far superior to solder joints because they are stronger, have better conductivity and are not susceptible to creep and fatigue failure. Wedge bonding, because it directly deforms the wire without first forming a ball, is capable of producing a weld with minimum deformation. High quality welds can be produced with deformation of 20-25% larger than the wire diameter. Figure 1 shows the common bonding processes and compares their deformation as a function of initial wire diameter for an optimized process. Nano- materials and devices incorporate a new class of materials with sub-micron grain size and unique properties to form smaller features and functions than previously achievable. Wedge bonding, because of its smaller bond size, room temperature bonding, lowest loop capabilities and lowest cost is the best choice of all interconnect methods for these new devices.|
|Lee Levine, Distinguished Member of the Technical Staff
Hesse & Knipps, Inc.
New Tripoli, PA