Here is the abstract you requested from the nano_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|NAMICS Materials for Thin & Advanced Packaging Technology|
|Keywords: Underfill, TSV, Pre-applied|
|Companies are looking to develop packages with less power consumption, faster processing, high reliability, high yield and low cost using the latest technologies of Thru Silicon Via (TSV), sub-100 micron die thickness, and 3-D / 2.5D technoloyg. As technology progress to smaller process generations new packaging applications are being demanded. The standard solder reflow process is being pushed by advancements in thermal compression bonding (TCB), vacuum underfill (VUF), wafer level and pre-applied materials. This presentation will centralize around the latest advancements in NAMICS Materials for Thin & Advanced Packaging Technology; Capillary Underfill (CUF), Vacuum Underfill (VUF), Pre-Applied Material, Non-Conductive Paste (NCP), Non-Conductive Films (NCF), High Thermal Conductivity, Conductive & Non-Conductive Die Attach Materials.|
|Tony Ruscigno, National Sales Manager
NAMICS Technologies, Inc.
Wappingers Falls, NY