Here is the abstract you requested from the nano_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Gold replacement - Nanofilm for oxidation barrier|
|Keywords: Gold replacement, Nanofilm, oxidation barrier|
|Gold has been widely used in the electronic industry for the purpose of soldering, electrical conductivity and chemical inertness. However, Gold is too expensive and there is extremely toxic chemicals used in the gold electroplating process. In order to reduce the cost of electronic device and create friendly environment, YINCAE Advanced Materials, LLC has developed ACP 120 Nanofilm series to replace gold application in the electronic industry. Solder wetting test, self-alignment, cross-section, X-ray and contact resistance tests have been conducted to compare electroplated gold with YINCAE nanofilm on the key performance. All results have been demonstrated APC 120 nanofilm is the good replacement of gold. All details will be discussed in the presentation.|
YINCAE Advanced Materials, LLC
Albany, New York