Micross

Abstract Preview

Here is the abstract you requested from the NHP_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Low Cost, Non-Hermetic Multi-Chip Module
Keywords: Non-Hermetic, Multi-Chip Module, MMIC
The packaging of RF multi-chip modules for military applications has historically employed the use of hermetic, ceramic-based substrates. Although these packaging schemes have proven to be highly robust in a variety of environments, they also carry a significantly higher cost than non-hermetic alternatives. In order to take advantage of the significant cost opportunities available, a multi-chip module was developed for an S-Band Radar using Monolithic Microwave Integrated Circuits (MMICs) in a combination of plastic overmolded and air cavity Quad Flat No-Lead (QFN) packages. These devices were subsequently assembled to a PCB constructed of industry-standard RF laminate materials and assembled using commercially available surface mount processes. Overall performance of this design matched performance predictions very well and environmental testing verified the robustness of the plastic QFN packaging approach. When implemented, this solution will significantly reduce the module cost for this system.
Matthew Gruber, Manager, MMICs and T/R Modules
Lockheed Martin
Moorestown, NJ
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems