Here is the abstract you requested from the NHP_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Development of Epoxy Sealed Packages for MEMS|
|Keywords: metrology, epoxy seals, reliability|
|Understanding the reliability requirements for an application may allow replacement of a hermetic enclosure with a suitably designed adhesive seal. Process and material characterization may be combined with suitable modeling tools, metrology, and physical analysis to thoroughly examine the serviceability of epoxy seals. We have been engaged in such development for over a decade, and herein we provide real-world examples of each of these tools and a blueprint for navigating the maze of requirements necessary to a successful product introduction.|
|S. Joshua Jacobs, Senior Member of the Technical Staff
Texas Instruments Incorporated