Here is the abstract you requested from the NHP_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|KEYNOTE PRESENTATION: Infusion of New Technology into the QML System|
|Keywords: New Technology, Non-Hermetic, QML System|
|The advances in packaging technology as well as increases in functional density and operating frequency have resulted in single die SoCs (System-on-a-Chip). For various reasons including cost trade-off, several of these chips are built with non-hermetic construction in high-pin-count, ceramic, column grid array packages. This talk will describe the efforts underway for the infusion of such devices into the QML (Qualified Manufacturer's List) system so they can be procured as standard space level products. Speaker Bio: Shri Agarwal is a Program Manager at NASA / Jet Propulsion Laboratory - California Institute of Technology. Additionally, he is the NASA point of contact on all matters related to QML (Qualified Manufacturer's List) microcircuits. He has over 35 years experience, and several publications to his credit. He received numerous awards for supporting NASA/JPL space flight projects. He holds Master's degrees from Agra University, India; IIT Delhi, India; and USC, Los Angeles. Currently, Shri is leading a NASA championed effort for the worldwide space community to bring the complex state-of-the-art non-hermetic microcircuits into the QML system (a.k.a. the Class Y initiative).|
|Dr. Shri G. Agarwal, Program Manager
Jet Propulsion Laboratory/NASA
Pasadena , CA