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Near-Hermetic Polymer Based Ultra-Thin Packages for Consumer Electronics and Bio-Electronics
Keywords: Near-Hermetic Polymer, Electronics and Bio-Electronics, Emerging Thermoset Dielectrics
The focus of this talk will be on advanced polymer dielectrics including liquid crystal polymers (LCP), and emerging thermoset dielectrics with extremely low moisture uptake. Results from substrate integration processes with high density through electrical vias with low He leak rates for implantable and wearable devices will be discussed. Chip-last embedding of ultra-thin Si and GaAs devices in precise thin cavity structures with low moisture permeation organic substrates for ultra-thin packages without mold compound will also be presented. Several demonstrators for consumer mobile and implantable bioelectronic applications are being developed as part of a global industry-academic partnership consortium at Georgia Tech.
Venky Sundaram, Director of Research
Georgia Institute of Technology (PRC)
Atlanta, GA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic