Here is the abstract you requested from the Printed_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Aerosol Jet® Printer as an Alternative to Wire Bond and TSV Technology for 3D Interconnect Applications|
|Keywords: 3D, Interconnect, Packaging|
|Optomec's Aerosol Jet print platform provides an evolutionary alternative to both wire bond and TSV technology, providing high density 3-dimensional interconnect capabilities which enable multi-functional integrated circuits to be stacked and vertically interconnected in high performance System-in-Package (SiP) solutions. The stacks can include 8 or more die, with a total stack height of ~ 1 mm. The printing system has a working distance of several mm which means that no Z-height adjustments are required for the interconnect printing. Closely coupled pneumatic atomizers with multiplexed print nozzles are used to achieve production throughput of greater than 15,000 interconnects per hour. The Aerosol Jet deposits silver nanoparticle ink connections on staggered multi-chip die stacks. High aspect ratio interconnects with <30-micron line width and 6-micron line heights have been demonstrated at sub 60-micron pitches. This paper will be further expanded to include pre-production qualification results, final production packaging, and further definition of the Aerosol Jet print platform integrated within a high throughput, manufacturing ready automation solution. The presentation will also provide a few additional examples of 3D printing with robotic arm and gantry motion control, as well as how the Aerosol Jet architecture and head/nozzle configurations can accomodate product development from concept through production.|
|Richard Plourde, Business Development