Here is the abstract you requested from the Printed_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Monolithic Smart Structures at the Nexus of Conformal Electronics and 3D Hyperintegration|
|Keywords: solid freeform fabrication, direct write electronics, conformal|
|Over the past decade, research in rapid prototyping of high-density circuitry (RPHDC) has attempted to integrate direct write (DW) conductive ink dispensing technology with stereolithography (SL) to manufacture smart monolithic structural members with integrated three-dimensional electronics. The original vision for this and similar 3D conformal electronics technologies was to spawn a paradigm shift in system-level manufacturing methods in applications where mass and/or geometric features directly drive cost, such as in space systems products, or those with irregular geometry designed to mimic natural objects. This presentation reviews the prior art and examines a possible nexus between RPHDC and the emerging field of 3D Hyperintegration that may benefit new and existing markets. Significant challenges are discussed, including practical three-dimensional interconnect for encapsulated ICs and discretes within stable SL or laser-sintered materials.|
Sandia National Laboratories