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Monolithic Smart Structures at the Nexus of Conformal Electronics and 3D Hyperintegration
Keywords: solid freeform fabrication, direct write electronics, conformal
Over the past decade, research in rapid prototyping of high-density circuitry (RPHDC) has attempted to integrate direct write (DW) conductive ink dispensing technology with stereolithography (SL) to manufacture smart monolithic structural members with integrated three-dimensional electronics. The original vision for this and similar 3D conformal electronics technologies was to spawn a paradigm shift in system-level manufacturing methods in applications where mass and/or geometric features directly drive cost, such as in space systems products, or those with irregular geometry designed to mimic natural objects. This presentation reviews the prior art and examines a possible nexus between RPHDC and the emerging field of 3D Hyperintegration that may benefit new and existing markets. Significant challenges are discussed, including practical three-dimensional interconnect for encapsulated ICs and discretes within stable SL or laser-sintered materials.
Jeremy Palmer,
Sandia National Laboratories
Albuquerque, NM

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