Micross

Abstract Preview

Here is the abstract you requested from the Printed_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Direct Print Additive Manufacturing as an alternative for 3D Electronic Packaging
Keywords: 3D electronic packaging, Additive Manufacturing, Direct Print
Next generation electronics will not change drastically in function; although batteries will last longer, devices will have more functions, and devices will take unique shapes, for the next several years electronic devices will continue to perform at the same standards that the industry has maintained for the past few decades. To meet the demands of more functions per device and unique shapes, the status quo of electronic manufacturing cannot persist. Solder, wire bonds, FR4, printed circuit boards, surface mount, and packaging will fight for survival, but just as handheld phones have evolved, so will the electronics that support them. Standard electronic packaging techniques are reaching size and density limits, forcing a search for alternative approaches. The idea of using Additive Manufacturing as an alternative for packaging has not been explored seriously enough, but there is an opportunity to demonstrate the significant advantages of true 3D electronic packaging by allowing the package to be the printed circuit board and by utilizing direct print and bare die approaches to print and structure diverse electronics.
Kenneth Church, President and CEO
nScrypt Inc.
Orlando, FL
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems