Micross

Abstract Preview

Here is the abstract you requested from the Printed_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

CNT Materials for Printed Electronic Packaging and Printed Flexible Electronics
Keywords: Carbon Nanotube, Printed Electronic Packaging, Printed Flexible Electronics
The trend in electronics markets is toward higher device functionality with greater portability, and yet the prices of such devices must be attractive to general consumers. To improve device functionality and portability, the electronics packaging industry has been experiencing a technology paradigm shift from traditional 2-dimensional (2-D) and rigid silicon semiconductor packaging technology to 3-dimensional (3-D) and conformal packaging and printing technology. To enable such a technology paradigm shift, Brewer Science has been developing printable carbon nanotube (CNT) materials and metallic nanoparticulate materials and processes for device fabrication, packaging, and assembly. In particular, the unique electrical and mechanical properties of CNTs make them an excellent component of 3-D and flexible (conformal) printed electronic packaging materials for interconnects, as well as for printing flexible electronic devices. CNT inks with specific rheological properties have been developed for screen and jet printing. Various device structures, including interconnects, printed circuitries, and active and passive printed devices, have been either screen or jet printed. The developed CNT printing processes were completed at relatively low temperature, avoiding the elevated temperatures currently used for the post-printing sintering process needed for printed metallic nanoparticulate interconnects. Lower-temperature processes are extremely necessary for producing printed flexible (conformal) electronics because the polymeric substrates are likely to be unstable at elevated temperatures. Another advantage of CNT interconnects is their mechanical flexibility, an essential requirement for flexible electronics. CNT interconnects are expected to maintain their conductivity when bent or stretched. The electrical and mechanical performance of the printed structures and devices, along with the CNT inks and printing processes, will be discussed in detail in this presentation
Wu-Sheng Shih, Technology Director
Brewer Science Inc.
Rolla, MO
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems