Here is the abstract you requested from the Printed_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|High Frequency 3D Simulation for High Frequency 3D Printed Electronics|
|Keywords: 3D Simulation, High Frequency, Design/Fabrication|
|Electronics fabrication through Additive Manufacturing methods opens doors into new means of electronic design that previously have been extremely difficult to realize. Additive Manufacturing has the potential to allow electronic systems to be easily embedded into objects printed on random polygonal surfaces consisting of various materials. Additive Manufacturing allows for electronics to rise from their restricted 2/2.5D space to full 3D designs. Printed 3D circuits can be increasingly useful in potentially replacing problematic areas of present day high-speed Gbps designs, such as connectors printed directly into a fully printed circuit board, chip packages printed directly into fully printed circuit board, lumped elements embedded into a fully printed circuit board, or RF shielding printed directly on the RF front end components. However, when high speed electronic circuit designs push into 3D space, some of the estimates previously used for 2/2.5D design analysis are no longer valid. High frequency 3D electronic designs will require more advanced 3D electromagnetic simulations. This presentation will overview some examples where modern day and future high frequency applications can benefit from an Additive Manufacturing design/fabrication approach and how 3D simulation analysis is used in the design of those structures. *Ph.D. Candidate under Dr. Raymond Rumpf, UTEP|
|Wade Smith, Senior Applications Engineer