Micross

Abstract Preview

Here is the abstract you requested from the rf_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

NiPdGold Plating Qualification of QFN RF-IC Packages
Keywords: RF-IC, Packaging, NiPdgold
Quad Flat No Leads (QFNs) are thermally enhanced plastic packages that use conventional copper leadframes. These leadless components provide an advanced packaging solution that reduces board real estate, with improved electrical and thermal performance over traditional leaded packages. The paper summarizes the qualification of NiPdGold finish component leads and solderability evaluations using eutectic and lead free solder. The solderability results were also compared to conventional silver plated copper leadframe with tin plated terminations. Visual inspection, X-sectional analysis , SEM/EDX, solderability tests, bond pull and reliability test results for thermal shock and temp./humidity tests including continuous improvement efforts at subcontract locations.
Mumtaz Y. Bora, Sr. Packaging Engineer
Peregrine Semiconductor
San Diego, CA
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems