Here is the abstract you requested from the rf_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Wedge Bonding for RF and Microwave Devices|
|Keywords: Wedge Bonding, RF Devices, Ribbon Bonding|
|RF and Microwave device interconnection requires demanding capabilities only wedge bonding can provide. Flat, extremely low loop shape, constant wire length and ribbon bonding are standard wedge bonding capabilities that cannot be produced by ball bonders. For high frequency electrical signals, conduction occurs in the "skin," or outer 0.5µm of the wire cross-section. Ribbon wire has a much larger "skin" than round wire; thus it is often required for RF and microwave devices. In addition, many high-speed devices require flat, short loops of the same wire length to match inductances of signals for proper performance. This technical presentation will provide an overview of how the latest wedge bonding equipment meets the highest demands of these RF and microwave devices, improving productivity and device quality. A flexible wire clamp design on wedge bonding equipment enables both round and ribbon wire to be easily interchanged on the same bond head. The bond wedge feeds the wire from behind and under the face of the tool, naturally producing low loop heights. Enhanced user-friendly software enables easy programming of low, stress-free loops, specification of constant wire length or constant loop height and precise control of ribbon deformation down to 1/4 mil. Enhanced tear routines also allow reverse bonding over raised structures (air bridges) on MEMS, RF and microwave devices. Advanced wedge bonders can also display looping profiles to aid in achieving the best electrical device performances. Wedge bonders are noted for their greater flexibility on difficult to bond surfaces. Soft touchdown and multiple defined bonding interval profiles are used to successfully bond challenging RF materials such as GaAs and Duroid. The S-shape bond feature allows the user to stack bonds or in some cases place two bonds on the same pad and fan the second bonds to different locations.|
|Lee Levine, Distinguished Member of the Technical Staff, Wedge Bonding Expert
Hesse & Knipps, Inc.
New Tripoli, PA