Micross

Abstract Preview

Here is the abstract you requested from the rf_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Printed Impedance Elements by Micro-Dispensing
Keywords: printed, impedance, circuits
The EM Lab in the W. M. Keck Center for 3D Innovation at the University of Texas at El Paso is developing technology to print passive circuit elements (R, L, and C) directly onto a substrate. The printing technology is based on micro-dispensing and can be implemented onto curved or complex substrates. The research so far has focused on printing inductors and capacitors. This paper summarizes this research and presents the results.
Ubaldo Robles, Research Associate
University of Texas at El Paso
El Paso, TX
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems