Micross

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PCB Creep Corrosion and Board Design Considerations
Keywords: Creep corrosion, MFG, Flux residue
According to the Restriction of Hazardous Substance (RoHS) legislation, the electronics industry is changing to lead-free rapidly, this lead to the application of many new materials and processes, such as solder alloy, the fluxes, and PCB surface finishes etc. Meanwhile, a particular type of failure termed creep corrosion was published frequently in recent years, which is mainly due to environmental exposure to sulfur-containing gases. The effects of different kinds of wave-soldering flux residues on creep corrosion were compared, and the results indicated that halogen-containing flux would accelerate creep corrosion.
Jingqiang He, Technical Manager
Huawei Technologies
Shenzhen, Guangdong
P.R.China


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