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Chip in Package on Board Simulations for Balanced RF Power Amplifier Design
Keywords: RF, Circuit Level, 2.5/3D
As RF circuit density and power increase, it is becoming critical to integrate circuit level, 3D electromagnetic and thermal analysis to support robust designs. Improvements in ANSYS circuit and electromagnetic software allow integrated electromagnetic simulations directly from a simple 2.5D layout environment. A layout can be directly integrated with linear and non-linear circuit and system elements, all in a single user interface. This presentation will first review the software environments enabling the design. The next portion of the presentation will demonstrate the use of the integrated flow in an RF chip in package on board design. The design consists of MMIC amplifiers in a package, mounted on a multi-layered substrate with stripline hybrids and various SMT components. Overall performance will be simulated, and analyses performed to predict the linear and non-linear characteristics of the cascaded amplifier chain, including the effects of packaging, wirebonds, vias, and cross coupling. Real-time tuning and optimization will be used to study the effects of fabrication and component tolerances. A thermal analysis based on the electromagnetic model will be shown which simulates the complete system of the chips, package and board. The link between solvers and the integrated software environment provides for a two-way interchange of information between electromagnetic and thermal models. Thermal effects can now be accounted for, such as temperature rise and thermal expansion but second order effects such as that of thermal expansion on system RF performance is investigated.
Marshall Loewenstein, Account Manager - Southern CA, Mexico
ANSYS, Inc.
Irvine, CA
USA


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