Here is the abstract you requested from the rf_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|RF/Microwave Packaging Trend and Thermal Challenges|
|Keywords: Packaging, Thermal , Challenge|
|This paper will introduce Typical Module Portfolio, Packaging Trend in Cellular World,New Tech in RF World and corresponding Thermal Challenges.|
|Qian Han (Angel), Principal Thermal & Reliability Engineer
San Diego, CA