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Thermo-Mechanical Properties of the Molding Compound in Harsh Environment
Keywords: Thermo-Mechanical Properties, Harsh Environment, Moisture effect
Semi-conductor devices are mostly encapsulated by epoxy molding compound (EMC) materials. During encapsulation stresses are generated due to the curing of the molding compound. Moreover, additional stresses will build up during cooling down from molding to ambient temperature caused by the differences in the coefficient of thermal expansion. These residual stresses add up to the stresses generated during mechanical loading and may lead to product failure. The viscoelastic properties of the encapsulation material depend highly on temperature, moisture and degree of cure. In case that moisture sensitivity was included in these researches the highest temperature had to be limited to 100 oC (In practice even to about 85 oC). This limitation is restrictive for the application of the obtained thermo-mechanical properties data in reliability studies of microelectronic packages. The present research focused on the thermo-mechanical properties of the EMCs in harsh environment, i.e. Temp>100 °C & RH≈100%. For the 1st time, viscoelastic data are produced for the harsh environment. For the present harsh environment study a special moisture-temperature-pressure chamber i.e. Pressure Vessel (PV) with a highly accurate tensile tester is designed and developed. The functionality and performance of the setup is assessed measuring the viscoelastic creep compliance of the EMC in dry condition supported by a measurement in a tensile tester machine, Zwick/Roell Z005. Applying the Time–Temperature Superposing principle, the viscoelastic master-curves and related shift factors are also extracted. Finally the viscoelastic behavior of the EMC for the harsh environment is determined and the effect of the moisture is considered.
Mahdi Sadeghinia, Ph.D. Researcher
Delft University of Technology
Zuid Holland 2628 CD,
Netherlands


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