Here is the abstract you requested from the SE_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Critical Plating Configuration for Reliable Aluminum-to-Gold Wire Bonds|
|Keywords: Wire Bond, Plating, Intermetallic|
|Integral to reliable aluminum-to-gold (Al-to-Au) wire bonds are the intermetallic compounds (IMC) initiated during bond formation. This is both known and documented in the microelectronics industry. Undiscovered in the literature is the importance of the physical configuration of the plating itself, that is its structure, or specifically, its grain structure. Recent investigation into the effects of the grain structure of Au plating on Al-to-Au wire bond reliability, as measured by renitence to thermal cycling, reveals the physical configuration essential to long-term wire bond reliability: large grain mono-layer gold. The study and its findings will be presented.|
|Richard Share, Principal
Share Consulting, LLC