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Critical Plating Configuration for Reliable Aluminum-to-Gold Wire Bonds
Keywords: Wire Bond, Plating, Intermetallic
Integral to reliable aluminum-to-gold (Al-to-Au) wire bonds are the intermetallic compounds (IMC) initiated during bond formation. This is both known and documented in the microelectronics industry. Undiscovered in the literature is the importance of the physical configuration of the plating itself, that is its structure, or specifically, its grain structure. Recent investigation into the effects of the grain structure of Au plating on Al-to-Au wire bond reliability, as measured by renitence to thermal cycling, reveals the physical configuration essential to long-term wire bond reliability: large grain mono-layer gold. The study and its findings will be presented.
Richard Share, Principal
Share Consulting, LLC
Macedon, NY

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic