Here is the abstract you requested from the SE_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Materials Interaction in Cofired Platinum /Alumina High Density Feedthrough for Implantable Neurostimulator Applications|
|Keywords: Ceramic , Medical Devices, high-density platinum via structure|
|Neurostimulator applications will require much higher I/O feedthrough density for hermetic implantable enclosures, often greater than 100 I/O. Alumina(or sapphire) with platinum wire center pin feedthroughs have been used in implantable electronics for 30 years and have a well documented biocompatibility and reliability history. This work evaluates the development of high-density platinum via structure cofired in alumina. The platinum was observed to melt when cofired from 1100 to 1550°C, almost 550°C below its melting point, independent of the particle size (nano to micron size particles) or particle morphology. An analysis of the effect of particle size (nano to micron size Pt), firing atmosphere (air, hydrogen, inert), firing temperatures and ramp rates, intermetallic and catalytic reactions and additives to control thermal expansion and adhesion strength was performed to evaluate and minimize this exothermic reaction. The interaction of platinum and alumina has been evaluated using high temperature X-ray diffraction, focus ion beam microsectioning, SEM and TEM analysis.|
|Ali Karbasi, Student
Florida International University