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|Fine Pitch Die-Level Testing Can Accelerate Development of Multi-Die Packaging Technologies Using Die Bonding Equipment|
|Keywords: Test, Fine Pitch, Multi-Die Package|
|Assembling multi-die modules with tested die drastically increases yield, decreases rework, and improves time to delivery. Access to die is limited, especially die tested to performance specifications. As the number of die increases in multi-die modules, progress towards design validation gets significantly harder and more time intensive. Instead of assembling articles without pre-testing the components, possibly performing module tests at critical steps, and then performing any final assembly testing once the article is complete, pre-testing the die could improve yield. Especially for research, rapid prototyping, or concept development efforts, even mild die yield loss can significantly impact progress. Yield rates will likely improve if testing and assembly efforts intertwine more cohesively. If vendor supplied Known Good Die (KGD) are not available, fine pitch die-level testing may be considered but is typically an expensive burden, if it is even possible. However, due to industry developments in high accuracy die bonders, the equipment used to bond die for the multi-die module may also be suitable to perform die-level testing if the equipment has tight control over accuracy, planarity, and low force application. By performing die-level testing with the existing bonding equipment, any die that can be successfully placed onto the module has the potential to be tested prior to assembly. Interestingly, live functional tests, temperature grading, and speed grading could also be accomplished. Prototyping and concept development for MCMs, SIPs, MCPs, 3DICs would be especially interested in performing directed functional tests. Care must be taken to design a test card appropriately, design a set of tests, and to not damage the die with any extra handling steps. Die-level testing with bonding equipment during early development phases has proven useful while assembling high-performance multi-die packaging technologies that include wirebonded, flip-chip, and Ball Grid Array (BGA) components.|
|David Herndon, Electrical Engineer