Here is the abstract you requested from the SE_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Monolithic 3D Printed Electronics - The Next Generation Packaging Technology|
|Keywords: Monolithic, 3D Printed Electronics, Packaging|
|Current packaging practices consist of designing the box and then filling the box with packaged devices. This is true for both commercial products and military systems whether it's an iPhone or Unmanned Air Vehicle. Great strides have been made in the world of the integrated circuit which consists of millions of transistors. Further volume efficiency is gained through the migration to 3D stacked silicon, this continues to evolve. However the packaging of these devices from die to system still is assembly and volume inefficient. Whether consumer or military, demand for more function per unit volume continues as well as “time to market” or “time to mission”. A paradigm shift is needed at the electronic packaging level to achieve these demands. The next generation packaging will need to take advantage of the system's mechanical structure as an integral electronically functional device. This paradigm would move a traditionally assembled Unmanned Air Vehicle (UAV) with sensor payload to a full function Unmanned Flying Sensor (UFS's). Today an UAV carries a payload; tomorrow the payload will be the UAV. With the evolution of additive manufacturing and printed electronics technologies, 3D Monolithix will demonstrate electronic fabrication from the ground up. Printing a monolithic 3D device will become the next generation electronic packaging technology, providing a clear example of how to place more electronic functions in a single device with the touch of a single button.|
|C. Mike Newton , Research Scientist
3D Monolithix Corp.