Micross

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Here is the abstract you requested from the Thermal_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Stacked Chip Thermal Model Validatio Using Thermal Test Chips
Keywords: Stacked Die, Thermal Test, Validation
Provided as PDF to organizing committee. Note: Tom Tarter will be the primary presenter; Bernie's IMAPS member number is shown.
Tom Tarter, President
Package Science Services LLC
Santa Clara, CA
USA


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