Abstract Preview

Here is the abstract you requested from the Thermal_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Techniques for Soldering Aluminum Alloys
Keywords: Aluminum, Soldering, Flux
Aluminum alloys, being a light weight, very abundant, relatively strong, and a low cost metal, has seen wide application use in many different fields. Many applications would like to join this metal to aluminum or other metals with a low temperature joining solution like soldering to preserve the aluminum alloy’s physical characteristics, provide a useful thermal or electrical pathway, and eliminate costly aluminum plating options often seen today. In response, techniques have been developed to directly solder aluminum with multiple methods such as flux, flux paste, coated solder preforms, flux cored solder wire, solderpaste, and pre-tinning the aluminum surface.
William Avery, Material Joining Specialist
Superior Flux & Mfg. Co.
Jamestown, NY

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic