Abstract Preview

Here is the abstract you requested from the Thermal_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Liquid Dispensable TIMs for Electronics Packaging
Keywords: Liquid dispensable, TIM, High Performance
The appropriate use of Thermal Interface Materials (TIMs) is critical in the design of microelectronic packages and assemblies incorporating today’s high performance processors in order to maintain reliable operating temperatures. While pad and gasket type (pre-cured) TIMs have historically been the default formats, there is increasing interest and demand for high performance liquid dispensable TIM materials. The advantages of liquid TIMs range from performance based (lower contact resistance and decreased assembly stresses) to manufacturing based (lower material usage per module and reduced inventory). When transitioning to the use of liquid TIMs one must consider points such as the TIM shelf life and maintenance of dispensing systems. In this discussion we will cover both the benefits and potential downsides to the use of liquid dispensable Thermal Interface Materials. In doing so we will make the case that the ability to tailor rheology and mechanical properties to the specific application as well as the ability to streamline high volume manufacturing provides sufficient benefit to strongly consider the use of liquid dispensable TIMs.
Ryan Verhulst , Research & Development Engineer
The Bergquist Company
Chanhassen, MN

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems