Here is the abstract you requested from the Thermal_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Realizing the Promise of Diamond_Copper composites for thermal management|
|Keywords: heat sinks, high conductivity, finishing|
|To support the high density and high operating voltage of increasingly high powered wide band gap (WBG) component, over the last 5 years FedTech Group has developed tailored metal matrix composites based on Diamond_Copper, which have thermal conductivity, K, in the range of 550-650 W/m.K and are isotropic with low thermal expansion. to match Si, GaAs, SiC and GaN active devices. The composites are available with variable volume loading of diamond from 40-65% and in thickness range from 0.015” to 0.2”. The finished parts have an integrated copper or silver machinable surface layer 2-4 mils thickness, which can be easily metalized. FedTech Group has addressed issues of machinability, dimensional tolerance, surface finish and edge retention of the composites so that the finished parts can be considered for direct replacement of existing heat sinks with precision tolerances of +/- 0,002 mils and surface roughness Ra, less than 20 micro-inch. Up until recently, these finishing operations for precision Diamond_Copper parts at a competitive price have been unattainable and provided an impediment to the introduction of these materials in large-scale applications. Currently FedTech Group’s Diamond_Copper manufacturing facility in Sacramento CA is operational and is producing prototype quantities of these finished parts in volumes of 2000 parts per month. The composites can replace current specialized spreader materials such as Cu/Mo/Cu or CuW materials for high power module applications.|
|Todd Johnson, Executive Director