Micross

Abstract Preview

Here is the abstract you requested from the Thermal_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Pumped two-phase cooling loop for high heat flux thermal management applications.
Keywords: Two phase cooling, Enhanced boiling coatings, minichannels
High power opto-electronic devices operate with typical energy efficiencies in the range of 50% for most commercially available products, and at best up to 75% for laboratory prototypes. As a result, substantial amount of waste heat is generated in such devices, which needs to be removed at typically high heat fluxes on the order of 350 W/cm2 and above. As the power density of devices continues to grow thanks to decreasing size/footprint and increasing power output, thermal management becomes a major design, packaging and operational concern. In order to meet the stringent cooling requirements of high heat flux devices, we have developed a pumped two phase cooling system that involves minichannel heat sinks with special boiling enhancement coatings. High rates of heat transfer can be achieved on coated minichannel heat sinks due to the combined effects of nucleate boiling, increased surface area and two-phase forced convection. Application of a microporous coating on the heat sink improves and stabilizes boiling, through providing large number of uniformly-distributed nucleation sites on the heat surface, as well as a capillary-assisted mechanism for coolant replenishment at the evaporation sites. Different kinds of coated minichannel heat sinks were fabricated and tested in a dedicated flow-boiling experimental setup. Results showed that the coated heat sinks have better thermal performance compared to uncoated heat sinks, as evident by the lower values of wall super heat (i.e. lower device temperature at a given heat flux), and extended Critical Heat Flux (CHF) due to dry-out prevention/postponement.
Ehsan Yakhshi-Tafti, Research & Development Engineer
Advanced Cooling Technologies, Inc.
Lancaster , PA
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems