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Thermal Analysis of xFD DRAM Packages with Rigorous Simulation and Experimental Validation
Keywords: DRAM package, thermal management, stacked die package
The design optimization for thermal management of systems relies heavily on accurate thermal models of the individual components. Invensas is developing new packaging concepts that provide enhanced and reliable performance electrically, thermally and mechanically. These development efforts use predictive finite element analysis to drive the optimization of package design for improved thermo-mechanical strain and thermal management. Therefore, it is important to validate such models through rigorous experimental thermal measurements. In this paper we will present details of our package design, assembly and the thermal test protocols. We will outline our methodologies for measuring thermal performance and achieving tight tolerances in the experimental apparatus as well as guidelines for making appropriate assumptions for associated simulations. The prototype package we built was a Dual-FaceDown (DFD™) DRAM package with thermal test die. We examined JEDEC standard test conditions for natural convection and forced air flow of 1 and 3m/sec. Comparing values obtained from experimental measurements with simulation data showed results that were within 10% margin in many cases. We will discuss in detail the important calibration protocol and considerations required in the experimental test area for enhanced precision.
Rongang Zhang, Principal Engineer
Invensas Corporation
San Jose, CA
USA


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