Here is the abstract you requested from the Thermal_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Thermal Analysis of xFD DRAM Packages with Rigorous Simulation and Experimental Validation|
|Keywords: DRAM package, thermal management, stacked die package|
|The design optimization for thermal management of systems relies heavily on accurate thermal models of the individual components. Invensas is developing new packaging concepts that provide enhanced and reliable performance electrically, thermally and mechanically. These development efforts use predictive finite element analysis to drive the optimization of package design for improved thermo-mechanical strain and thermal management. Therefore, it is important to validate such models through rigorous experimental thermal measurements. In this paper we will present details of our package design, assembly and the thermal test protocols. We will outline our methodologies for measuring thermal performance and achieving tight tolerances in the experimental apparatus as well as guidelines for making appropriate assumptions for associated simulations. The prototype package we built was a Dual-FaceDown (DFD™) DRAM package with thermal test die. We examined JEDEC standard test conditions for natural convection and forced air flow of 1 and 3m/sec. Comparing values obtained from experimental measurements with simulation data showed results that were within 10% margin in many cases. We will discuss in detail the important calibration protocol and considerations required in the experimental test area for enhanced precision.|
|Rongang Zhang, Principal Engineer
San Jose, CA