Here is the abstract you requested from the Thermal_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|TIM for CPU Server Applications: High Performance Thermal Conductive Sheets filled with Carbon Fibers|
|Keywords: CPU Server, TIM , Conductive|
|Along with the expansion of cloud computing, data processing capacity has greatly advanced with each coming year. As a result, CPU servers have become more technologically advanced and efficient heat dispersal technology has become increasingly vital. However, server dimensions are restricted and there is a limited degree of freedom available when taking on the matter of cooling. Besides TIM materials, there is also the need for advancement in cooling materials and systems. Based on this context, Dexerials Corporation has released a carbon fiber sheet that has a high rate of thickness direction heat conductivity and excellent pliability. In this report, Dexerials Corporation and the National Institute of Advanced Industrial Science and Technology (AIST) compared the thermal qualities of various TIM materials under different measurement conditions. As a result of this research, it was confirmed that Dexerials Corporation's carbon fiber sheet is capable of achieving a conductivity level of 0.2K-cm2/W at 14PSI; this is equivalent to the often used heat dissipation grease. Regarding pliability, the carbon fiber sheet achieved a compression rate of approximately 10% at 14PSI. To further evaluate performance, the sheets were then placed into AIST servers and CPU case temperature was measured where CPU load factors were changed. It was confirmed that not only thermal resistance, but also TIM material pliability influences actual cooling capabilities. Our carbon fiber sheet's excellent performance was further confirmed during this testing.|
|Hiroyuki Ryoson, Engineer