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Experimental investigation of temperature-current rise in embedded PCB traces
Keywords: Embedded PCBs, PCB trace layers, temperature-current diagrams
Passive and active discrete chips embedding using advanced PCB processes and state-of-the-art materials show good potential to realize cost-effective packages with improved thermal and electrical performance. However, there are technological limitations to the temperature of copper traces: it must not exceed certain limits, e.g. the PCB top transition temperature, or a comparable limit to solder stability aspects. The set of temperature-current diagrams for different embedded PCB scenarios are presented and analyzed. The base substrate materials Al and ceramic (Al2O3), dielectric layer - polyimide film with thickness 4-8 um, trace line (Ti 0.05 um, Cu 1.2 um, Ni 0.2 um) with thickness 1-3 um and width 100-200 um were investigated. The temperature caused by Joule heating was measured using IR camera Flir A40. For different cases the current was set in the range of 0.2-8.5 A; the measured temperature was in the range of 22-144 degC. The close agreement between the results measured and simulated with ElCut software tool was achieved. Authors are not familiar with similar published results for 1-3 um thin traces for embedded PCBs.
Konstantin Petrosyants, Chief of department of Electronics and Nanoelectronics
Moscow Institute of Electronics and Mathematics of Higher School of Economics
Moscow, Moscow
Russian Federation

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