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Here is the abstract you requested from the Thermal_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

On the Difficulty of Measuring the Case Temperature of an Over-Molded IC Package
Keywords: IC Package Thermal Testing, Temperature Measurement, Temperature Measurement Errors
It is a relatively simple task to make an accurate case temperature measurement of an IC package that has a high conductivity lid. If the thermocouple is attached properly, the thermocouple junction should be within a few tenths of a degree of the lid surface temperature. However, if the case of the IC package is made from a low conductivity material, such as exists with an over-molded IC package, great care must be taken to make an accurate temperature measurement. If the plastic package has a heat sink attached, it is next to impossible to make an accurate case temperature measurement. This presentation will discuss the magnitude of the errors created when attaching a thermocouple to measure the case temperature of an IC. It will emphasize the temperature distortion that occurs in the case temperature of an over-molded IC package due to the presence of a thermocouple. The temperature distortion is especially pronounced when a heat sink is attached.
Guy R Wagner, Director
Electronic Cooling Solutions
Santa Clara, CA
USA


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