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Thermal characterization of a BGA package used in the logic board of a handheld device, IMAPS 2012
Keywords: Tablet, Transient, BGA
Flip chip BGA packages are commonly used in handheld tablet devices. The requirement that handheld devices provide better performance with a smaller form factor presents significant challenges for thermal management. Numerical simulations are essential for predicting the performance of the cooling solution of a tablet device. In order to build models that can reliably predict the effect of different thermal management solutions, it is essential to use data from accurate thermal characterization of the main processor. In this presentation, the challenges of experimentally measuring the thermal performance data of Rth-JC and Rth-JA of a flip chip ball grid array device is presented. The tested device is a BGA package with a heat spreader. It is also the main processor of a commercially available handheld tablet. A transient measurement method is used to obtain the temperature responses of the diodes. The structure functions of the diodes are measured, and the thermal resistances are calculated. The model derived from the transient test method is then used in simulations to obtain a calibrated thermal model of the main processor.
Emil Rahim,
Electronic Cooling Solutions
Santa Clara, CA

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